Thermal Paste
Thermal paste is a chemical compound which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces from the interface area between the electronic component and the heat sink in order to maximize heat transfer and dissipation.
Thermal paste is also referred to as thermal compound, thermal grease, thermal interface material, thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease.
Thermal Grease - HY 510 For CPU, GPU, LED, Chipset, Transistors etc.
HY510 Heatsink compound / thermal grease is used for thermal coupling of electronic and electrical devices like CPU, GPU, LED, Chipset and general electronic components to heat sink for optimum heat transfer to the heat sink. Heat Sink Compound, Thermal Grease, Heat Sink Paste, Thermal Paste all ..
Thermal Paste - Maxtor CTG1 For CPU and GPU Chips
Maxtor CTG1 is a high-performance thermal paste (also known as thermal conductive silicone grease or thermal compound), which is mainly used in computer CPU chips and GPU chips. It offers high thermal conductivity, good operability and long service life. Specifications: Conductivity (W/m-k): 4..